Driving chip and display panel

ABSTRACT

A driving chip and a display panel are provided. The display panel includes the driving chip, and a plurality of first bonding pads and a plurality of second bonding pads disposed at two opposite sides of the driving chip. The driving chip includes a group of first input leads and a group of second input leads. There is an interval between the group of first input leads and the group of second input leads. The group of first input leads is disposed near the first bonding pads, and the group of second input leads is disposed near the second bonding pads.

BACKGROUND OF DISCLOSURE 1. Field of Disclosure

The present disclosure relates to the field of display technology, andmore particularly, to a driving chip and a display panel.

2. Description of Related Art

As shown in FIG. 1, in conventional technologies, a driving chip 10 isbonded on a glass substrate of a display panel 100, and a flexibleprinted circuit board 20 is disposed at two sides of the driving chip 10so that a narrow frame can be realized in the display panel 100.However, because the flexible printed circuit board 20 is bonded at twosides of the driving chip 10, conducting wires electrically connectingthe flexible printed circuit board 20 and the driving chip 10 are toolong, causing impedance to be too great so that the display panel maynot display normally.

Therefore, it is necessary to provide a technical solution to solve theproblem that the display panel cannot display normally due to too greatimpedance resulting from too long conducting wires.

SUMMARY

A technical problem is that, the present disclosure aims to provide adriving chip and a display panel to reduce impedance of conducting wiresconnecting bonding pads of the display panel and input leads of thedriving chip due to a short distance between the bonding pads and theinput leads so that the display panel can display normally.

A display panel, including a display area and a non-display area locatedat the outside of the display area; wherein a driving chip, and aplurality of first bonding pads and a plurality of second bonding padsdisposed at two opposite sides of the driving chip are disposed in thenon-display area; and wherein the driving chip includes a plurality ofinput leads including a group of first input leads and a group of secondinput leads, wherein the group of first input leads is disposed near theplurality of first bonding pads, wherein the group of second input leadsis disposed near the plurality of second bonding pads, and wherein thereis an interval between the group of first input leads and the group ofsecond input leads.

In the above display panel, each of the first input leads iselectrically connected to each of the plurality of first bonding padsthrough conducting wires, and each of the second input leads iselectrically connected to each of the plurality of second bonding padsthrough the conducting wires.

In the above display panel, the group of first input leads and the groupof second input leads are disposed side by side at the same side of thedriving chip.

In the above display panel, the driving chip further includes aplurality of output leads.

In the above display panel, the plurality of output leads, the group offirst input leads, and the group of second input leads are disposed sideby side, and the plurality of output leads are located between the groupof first input leads and the group of second input leads.

In the above display panel, the plurality of output leads are disposedat sides of the group of first input leads and the group of second inputleads, opposite to each other.

In the above display panel, the driving chip further includes aplurality of virtual leads.

In the above display panel, the plurality of output leads, the group offirst input leads, and the group of second input leads are disposed sideby side at a side of the driving chip, away from the display area, theplurality of output leads are located between the group of first inputleads and the group of second input leads, and the plurality of virtualleads are located at a side of the driving chip, near the display area.

In the above display panel, the plurality of first bonding pads, nearthe first input leads, are electrically connected to the first inputleads, near the plurality of first bonding pads, through firstconducting wires, and the plurality of first bonding pads, away from thefirst input leads, are electrically connected to the first input leads,away from the plurality of first bonding pads, through second conductingwires.

In the above display panel, the plurality of output leads, the group offirst input leads, and the group of second input leads are disposed sideby side at a side of the driving chip, near the display area, theplurality of output leads are located between the group of first inputleads and the group of second input leads, and the plurality of virtualleads are located at a side of the driving chip, away from the displayarea.

In the above display panel, the plurality of first bonding pads, nearthe first input leads, are electrically connected to the first inputleads, away from the plurality of first bonding pads, through firstconducting wires, and the plurality of first bonding pads, away from thefirst input leads, are electrically connected to the first input leads,near the plurality of first bonding pads, through second conductingwires.

In the above display panel, the plurality of output leads are located ata side of the driving chip, near the display area, the plurality ofvirtual leads, the group of first input leads, and the group of secondinput leads are disposed side by side at a side of the driving chip,away from the display area, and the plurality of virtual leads arelocated between the group of first input leads and the group of secondinput leads.

In the above display panel, heights of a part of the plurality of firstbonding pads and heights of a part of the plurality of second bondingpads increase gradually from a side near the driving chip to a side awayfrom the driving chip.

In the above display panel, a first bonding pad group is composed of thepart of the plurality of first bonding pads, a third bonding pad groupis composed of the part of the plurality of second bonding pads, theplurality of first bonding pads of the first bonding pad group arearranged continuously or discontinuously, and the plurality of secondbonding pads of the third bonding pad group are arranged continuously ordiscontinuously.

A driving chip, including a plurality of input leads including a groupof first input leads and a group of second input leads, wherein thegroup of first input leads and the group of second input leads aredisposed at an interval.

In the above driving chip, the group of first input leads and the groupof second input leads are disposed side by side at the same side of thedriving chip.

The above driving chip further includes a plurality of output leads,wherein the plurality of output leads, the group of first input leads,and the group of second input leads are disposed side by side, andwherein the plurality of output leads are located between the group offirst input leads and the group of second input leads.

The above driving chip further includes a plurality of output leads,wherein the plurality of output leads are disposed at sides of the firstinput leads and the second input leads, opposite to each other.

The above driving chip further includes a plurality of virtual leads,wherein the plurality of virtual leads, the group of first input leads,and the group of second input leads are disposed side by side, andwherein the plurality of virtual leads are located between the group offirst input leads and the group of second input leads.

The above driving chip further includes a plurality of virtual leads,wherein the plurality of virtual leads are disposed at sides of thefirst input leads and the second input leads, opposite to each other.

The beneficial effect of the present disclosure is that, the presentdisclosure provides the driving chip and the display panel. The displaypanel includes the driving chip, and the plurality of first bonding padsand the plurality of second bonding pads disposed at two opposite sidesof the driving chip. The driving chip includes the plurality of inputleads including the group of first input leads and the group of secondinput leads. There is an interval between the group of first input leadsand the group of second input leads. In order to reduce the distancebetween the first input leads and the first bonding pads and thedistance between the second input leads and the second bonding pads, thegroup of first input leads is disposed near the plurality of firstbonding pads, and the group of second input leads is disposed near theplurality of second bonding pads, thereby shortening conducting wires,electrically connecting the first input leads and the first bondingpads, and conducting wires, electrically connecting the second inputleads and the second bonding pads, and thus reducing impedance ofconducting wires so that electrical signals are inputted to the drivingchip normally, and thus the display panel displays normally.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a schematic diagram of a driving chip and a flexible printedcircuit board, bonded on a display panel in conventional technologies.

FIG. 2 is a schematic structural diagram of a display panel according toa first embodiment of the present disclosure.

FIG. 3A is a first schematic diagram of first bonding pads in thedisplay panel shown in FIG. 2.

FIG. 3B is a second schematic diagram of the first bonding pads in thedisplay panel shown in FIG. 2.

FIG. 3C is a third schematic diagram of the first bonding pads in thedisplay panel shown in FIG. 2.

FIG. 3D is a fourth schematic diagram of the first bonding pads in thedisplay panel shown in FIG. 2.

FIG. 3E is a fifth schematic diagram of the first bonding pads in thedisplay panel shown in FIG. 2.

FIG. 4 is a schematic structural diagram of a display panel according toa second embodiment of the present disclosure.

FIG. 5 is a schematic structural diagram of a display panel according toa third embodiment of the present disclosure.

FIG. 6 is a schematic structural diagram of a display panel according toa fourth embodiment of the present disclosure.

FIG. 7 is a schematic structural diagram of a display panel according toa fifth embodiment of the present disclosure.

FIG. 8 is a schematic structural diagram of a display panel according toa sixth embodiment of the present disclosure.

Notations in the accompanying drawings are as follows:

A display panel 100, a display area 100 a, a non-display area 100 b,driving chips 10 and 11, a group of first input leads 111, a group ofsecond input leads 112, first input leads 1111, second input leads 1121,output leads 113, virtual leads 114, first bonding pads 141, secondbonding pads 142, a first bonding pad group 141 a, a second bonding padgroup 141 b, a third bonding pad group 142 a, a fourth bonding pad group142 b, a first child bonding pad 1411, a second child bonding pad 1412,a third child bonding pad 1413, a fourth child bonding pad 1414, a fifthchild bonding pad 1415, a sixth child bonding pad 1416, first conductingwires 161, second conducting wires 162, fan-out traces 18, and aflexible printed circuit board 20.

DETAILED DESCRIPTION OF EMBODIMENTS

For the embodiments of the present disclosure, their technical solutionswill be described clearly and completely in conjunction with theiraccompanying drawings below. It is obvious that the embodimentsdescribed herein are merely a part of the embodiments of the presentdisclosure instead of all of the embodiments. A person having ordinaryskill in this field can obtain other embodiments according to theembodiments of the present disclosure under the premise of not payingcreative works, and all of these embodiments should be within theprotective scope of the present disclosure.

Please refer to FIG. 2, which is a schematic structural diagram of adisplay panel according to a first embodiment of the present disclosure.The display panel 100 is a liquid crystal display panel or an organiclight-emitting diode display panel. The display panel 100 includes adisplay area 100 a and a non-display area 100 b located at the outsideof the display area 100 a. A driving chip 11, a plurality of firstbonding pads 141, and a plurality of second bonding pads 142 aredisposed in the non-display area 100 b.

The driving chip 11 is located at the middle of a side of thenon-display area 100 b of the display panel 100. The driving chip 11includes a plurality of input leads, a plurality of output leads 113,and a plurality of virtual leads 114. The plurality of input leadsinclude a group of first input leads 111 and a group of second inputleads 112.

The group of first input leads 111 and the group of second input leads112 are both used to input electrical signals to the driving chip 11.The group of first input leads 111 includes a plurality of first inputleads 1111, and the group of second input leads 112 includes a pluralityof second input leads 1121. There is an interval between the group offirst input leads 111 and the group of second input leads 112. The groupof first input leads 111 is disposed near the plurality of first bondingpads 141, and the group of second input leads 112 is disposed near theplurality of second bonding pads 142. That is, the first input leads1111 are disposed to gather at a side of the driving chip 11, near theplurality of first bonding pads 141, and the second input leads 1121 aredisposed to gather at a side of the driving chip 11, near the pluralityof second bonding pads 142. The group of first input leads 111 and thegroup of second input leads 112 are disposed at an interval and at twoends of the driving chip 11, so that the distances between the pluralityof first bonding pads 141 and the first input leads 1111 of the group offirst input leads 111 become short, and the distances between theplurality of second bonding pads 142 and the second input leads 1121 ofthe group of second input leads 112 become short. Compared withconventional technologies, in the present disclosure, the distancesbetween the first bonding pads 141 and the group of first input leads111 become shorter, and the distances between the second bonding pads142 and the group of second input leads 112 become shorter, therebyshortening conducting wires, connecting the first input leads 1111 andthe first bonding pads 141, and conducting wires, connecting the secondinput leads 1121 and the second bonding pads 142, and thus reducingimpedance of conducting wires so that electrical signals are sure to beinputted to the driving chip 11 normally, and thus the display paneldisplays normally. Specifically, in the present disclosure, the lengthsof conducting wires, connecting the driving chip 11 and bonding pads 142away from the driving chip 11, are reduced through disposing the groupof first input leads 111 near a side of the first bonding pads 141 andthrough disposing the group of second input leads 112 near a side of thesecond bonding pads 142, thereby reducing impedance of conducting wiresso that the display panel displays images normally.

The group of first input leads 111 and the group of second input leads112 are disposed side by side at the same side of the driving chip 11.The plurality of output leads 113, the group of first input leads 111,and the group of second input leads 112 are disposed side by side, andthe plurality of output leads 113 are located between the group of firstinput leads 111 and the group of second input leads 112. Specifically,the plurality of output leads 113, the group of first input leads 111,and the group of second input leads 112 are disposed side by side at aside of the driving chip 11, away from the display area 100 a, and theplurality of output leads 113 are located between the group of firstinput leads 111 and the group of second input leads 112. The pluralityof output leads 113 are also located in the middle of the driving chip11, away from the display area 100 a. The first input leads 1111 aredisposed side by side at an equal interval, the second input leads 1121are disposed side by side at an equal interval, and the output leads 113are disposed side by side at an equal interval. It can be understoodthat the group of first input leads 111 can also intersect with thegroup of second input leads 112, as long as the distances between thefirst input leads 1111 and the first bonding pads 141 become short andthe distances between the second input leads 1121 and the second bondingpads 142 become short.

It needs to be explained that, in order that the output leads 113, thefirst input leads 111, and the second input leads 112 are disposed sideby side, and the output leads 113 are disposed between the group offirst input leads 111 and the group of second input leads 112, the sizeof the driving chip in the present disclosure has no change relative toconventional driving chips. Relative to conventional technologies,conventional input leads are filtered in the present disclosure, thatis, discarding input leads which have no influence on the driving chipafter the input leads being discarded, such as discarding input leadswhich having the same functions in order to reduce the number of inputleads, then dividing the rest of the input leads into the group of firstinput leads 111 and the group of second input leads 112, and thendisposing the output leads 113 between the group of first input leads111 and the group of second input leads 112. In the present disclosure,when the group of first input leads 111 and the group of second inputleads 112 are disposed side by side, leads including virtual leads orall of the output leads in conventional technologies can be disposedbetween the group of first input leads 111 and the group of second inputleads 112.

The virtual leads 114 are used to cause the driving chip 11 to be bondedsmoothly on the display panel 100. The virtual leads 114 are located ata side of the driving chip 11, near the display area 100 a.Specifically, as shown in FIG. 2, the virtual leads 114 are aligned sideby side at the side of the driving chip 11, near the display area 100 a.The virtual leads 114 are not connected to electrical signals. Thevirtual leads 114 whose thicknesses perpendicular to a thicknessdirection of the driving chip 11 are equal to thicknesses of the firstinput leads 1111, the second input leads 1121, and the output leads 113,perpendicular to the thickness direction of the driving chip 11. Thethicknesses of the first input leads 1111, the second input leads 1121,and the output leads 113, perpendicular to the thickness direction ofthe driving chip 11, are identical so that the driving chip 11 can bebonded smoothly on a glass substrate of the display panel 100.

The first bonding pads 141 and the second bonding pads 142 are disposedat two opposite sides of the driving chip 11 respectively. The firstbonding pads 141 are located at a side, where the driving chip 11 is,and adjacent to a side of the display area 100 a, where the driving chip11 is. Each of the first input leads 1111 is connected to each of thefirst bonding pads 141 through conducting wires, and each of the secondinput leads 1121 is connected to each of the second bonding pads 142through the conducting wires. Heights of a part of the first bondingpads 141 and heights of a part of the second bonding pads 142 increasegradually from a side near the driving chip 11 to a side away from thedriving chip 11 in order to solve the problem of abnormal display causedby short circuits, resulting from too crowded conducting wires near aside of the driving chip due to a smaller space near the driving chipwhen heights of the bonding pads in conventional technologies areidentical.

As shown in FIG. 2, a first bonding pad group 141 a is composed of apart of the first bonding pads 141. The first bonding pads 141 furtherinclude a second bonding pad group 141 b besides the first bonding padgroup 141 a. A third bonding pad group 142 a is composed of a part ofthe second bonding pads 142. The second bonding pads 142 further includea fourth bonding pad group 142 b besides the third bonding pad group 142a. The first bonding pads 141 of the first bonding pad group 141 a arearranged continuously or discontinuously, and the second bonding pads142 of the third bonding pad group 142 a are arranged continuously ordiscontinuously. The heights of the first bonding pads 141 of the firstbonding pad group 141 a, which are arranged continuously, increasesequentially from the side near the driving chip 11 to the side awayfrom the driving chip 11. The heights of the second bonding pads 142 ofthe third bonding pad group 142 a, which are arranged continuously,increase sequentially from the side near the driving chip 11 to the sideaway from the driving chip 11. The third bonding pad group 142 a isdisposed near a side of the driving chip 11, and the fourth bonding padgroup 142 b is disposed away from the side of the driving chip 11.

In order to expand the technical solution that the heights of the partof the first bonding pads 141 increase gradually from the side near thedriving chip 11 to the side away from the driving chip 11, for instance,the number of the first bonding pads 141 can be, but not limited to,six. The first bonding pads 141 include a first child bonding pad 1411,a second child bonding pad 1412, a third child bonding pad 1413, afourth child bonding pad 1414, a fifth child bonding pad 1415, and asixth child bonding pad 1416, sequentially arranged from the side nearthe driving chip 11 to the side away from the driving chip 11.

As shown in FIG. 3A, which is a first schematic diagram of first bondingpads in the display panel shown in FIG. 2. All of the first bonding pads141 are included in the first bonding pad group 141 a. Heights of thefirst bonding pads 141 sequentially gradually increase from the sidenear the driving chip 11 to the side away from the driving chip 11 inorder to enlarge the space, at the top of the first bonding pads 141near the driving chip 11 and configured for arranging the conductingwires, and avoid abnormal display caused by short circuits occurring inthe conducting wires, connecting the first input leads 1111 and thefirst bonding pads 141.

As shown in FIG. 3B, which is a second schematic diagram of the firstbonding pads in the display panel shown in FIG. 2. The first bondingpads 141 are included in the first bonding pad group 141 a and thesecond bonding pad group 141 b. The second bonding pad group 141 b islocated between the first bonding pad group 141 a and the driving chip11. The first bonding pad group 141 a includes the fourth child bondingpad 1414, the fifth child bonding pad 1415, and the sixth child bondingpad 1416. The second bonding pad group 141 b includes the first childbonding pad 1411, the second child bonding pad 1412, and the third childbonding pad 1413. In the first bonding pad group 141 a, the height ofthe fourth child bonding pad 1414 is less than the height of the fifthchild bonding pad 1415, and the height of the fifth child bonding pad1415 is less than the height of the sixth child bonding pad 1416. Inorder to increase a layout space of conducting wires, heights of thefirst child bonding pad 1411, the second child bonding pad 1412, and thethird child bonding pad 1413 are less than or equal to the height of thefourth child bonding pad 1414. In other embodiments with the firstbonding pads, the heights of the first child bonding pad 1411, thesecond child bonding pad 1412, and the third child bonding pad 1413 canalso be greater than the height of the fourth child bonding pad 1414.

As shown in FIG. 3C, which is a third schematic diagram of the firstbonding pads in the display panel shown in FIG. 2. The first bondingpads 141 are included in the first bonding pad group 141 a and thesecond bonding pad groups 14 1 b. The second bonding pad groups 141 b islocated at two sides of the first bonding pad group 141 a. The firstbonding pad group 141 a includes the second child bonding pad 1412, thethird child bonding pad 1413, and the fourth child bonding pad 1414. Thesecond bonding pad groups 141 b includes the first child bonding pad1411, the fifth child bonding pad 1415, and the sixth child bonding pad1416. In the first bonding pad group 141 a, the height of the secondchild bonding pad 1412 is less than the height of the third childbonding pad 1413, and the height of the third child bonding pad 1413 isless than the height of the fourth child bonding pad 1414. In order toincrease the layout space of conducting wires, the height of the firstchild bonding pad 1411 can be less than or equal to the height of thesecond child bonding pad 1412, and heights of the fifth child bondingpad 1415 and the sixth child bonding pad 1416 can be greater than orequal to the height of the fourth child bonding pad 1414. It can beunderstood that the heights of the fifth child bonding pad 1415 and thesixth child bonding pad 1416 can also be less than the height of thefourth child bonding pad 1414.

As shown in FIG. 3D, which is a fourth schematic diagram of the firstbonding pads in the display panel shown in FIG. 2. The first bondingpads 141 are included in the first bonding pad group 141 a and thesecond bonding pad group 141 b. The first bonding pad group 141 a islocated between the second bonding pad group 141 b and the driving chip11. The first bonding pad group 141 a includes the first child bondingpad 1411, the second child bonding pad 1412, and the third child bondingpad 1413. The second bonding pad group 141 b includes the fourth childbonding pad 1414, the fifth child bonding pad 1415, and the sixth childbonding pad 1416. The height of the first child bonding pad 1411 is lessthan the height of the second child bonding pad 1412, and the height ofthe second child bonding pad 1412 is less than the height of the thirdchild bonding pad 1413. Heights of the fourth child bonding pad 1414,the fifth child bonding pad 1415, and the sixth child bonding pad 1416can be greater than or equal to or less than the height of the thirdchild bonding pad 1413.

As shown in FIG. 3E, which is a fifth schematic diagram of the firstbonding pads in the display panel shown in FIG. 2. The first bondingpads 141 are included in the first bonding pad group 141 a and thesecond bonding pad group 141 b. The first bonding pad group 141 a caninclude any two of the first bonding pads 141, arranged at an interval.Specifically, the first bonding pad group 141 a includes the first childbonding pad 1411, the third child bonding pad 1413, and the fifth childbonding pad 1415. The second bonding pad group 141 b includes the secondchild bonding pad 1412, the fourth child bonding pad 1414, and the sixthchild bonding pad 1416. The height of the first child bonding pad 1411is less than the height of the third child bonding pad 1413, and theheight of the third child bonding pad 1413 is less than the height ofthe fifth child bonding pad 1415. The height of the second child bondingpad 1412 can be between heights of the first child bonding pad 1411 andthe third child bonding pad 1413 or equal to the height of any one ofthe first child bonding pad 1411 and the third child bonding pad 1413.The height of the fourth child bonding pad 1414 can be between heightsof the third child bonding pad 1413 and the fifth child bonding pad 1415or equal to the height of any one of the third child bonding pad 1413and the fifth child bonding pad 1415. The height of the sixth childbonding pad 1416 can be greater than or equal to or less than the heightof the fifth child bonding pad 1415. In other schematic diagrams withthe first bonding pads, the number of the first bonding pads 141, in thesecond bonding pad group 141 b and between the first child bonding pad1411 and the third child bonding pad 1413, can be, but not limited to,one or more than one. The number of the first bonding pads 141, in thesecond bonding pad group 141 b and between the third child bonding pad1413 and the fifth child bonding pad 1415, can be, but not limited to,one or more than one.

The arrangement method of the second bonding pads 142 is the same asthat of the first bonding pads 141 and is therefore not described indetail here.

Specifically, heights of a part of the first bonding pads 141sequentially gradually increase from the side near the driving chip 11to the side away from the driving chip 11. Heights of a part of thesecond bonding pads 142 sequentially gradually increase from the sidenear the driving chip 11 to the side away from the driving chip 11.Thus, abnormal display caused by short circuits occurring in theconducting wires, connecting the first input leads 1111 and the firstbonding pads 141 and connecting the second input leads 1121 and thesecond bonding pads 142, is avoided further.

The first bonding pads 141 are disposed side by side at an equalinterval, and the areas of any two of the first bonding pads 141 areidentical. The second bonding pads 142 are disposed side by side at anequal interval, and the areas of any two of the second bonding pads 142are identical. The first bonding pads 141 and the second bonding pads142 have shapes of regular figures or irregular figures. The regularfigures include a rectangle, a trapezoid, and so on.

Further, the difference in height between any two adjacent first bondingpads 141 is identical, and the difference in height between any twoadjacent second bonding pads 142 is identical.

The first bonding pads 141 (such as the first child bonding pad 1411),near the first input leads 1111, are electrically connected to the firstinput leads 1111, near the first bonding pads 141, through firstconducting wires 161. The first bonding pads 141(such as the sixth childbonding pad 1416), away from the first input leads 1111, areelectrically connected to the first input leads 1111, away from thefirst bonding pads 141, through second conducting wires 162. The lengthsof the first conducting wires 161 are less than those of the secondconducting wires 162. Because the first conducting wires 161 have shortlengths and small impedance, the first bonding pads 141, near the firstinput leads 1111, are used to input electrical signals demanding smallresistance of conducting wire to the first input leads 1111, near thefirst bonding pads 141, and the first bonding pads 141, away from thefirst input leads 1111, are used to input electrical signals withoutdemanding small resistance of conducting wire to the first input leads1111, away from the first bonding pads 141.

It needs to be stated that the upper space of the driving chip 11 (i.e.,the side space of the driving chip 11 where the virtual leads 114 inFIG. 2 are located) can be used to arrange fan-out traces 18 extendingfrom the display area 100 a to the driving chip 11, that is, a part ofspace occupied by the fan-out traces 18 and space occupied by thedriving chip 11 overlap, thereby reducing an interval between thedisplay area 100 a and the driving chip 11 and narrowing a bottom frameof the display panel 100 in the embodiments of the present disclosure.

Please refer to FIG. 4, which is a schematic structural diagram of adisplay panel according to a second embodiment of the presentdisclosure. The display panel 100 shown in FIG. 4 is basically similarto the display panel shown in FIG. 2, and their difference is that thevirtual leads 114 are distributed as an arc line. It can be understoodthat the virtual leads 114 can also be distributed as other shapes, aslong as it is ensured that the driving chip 11 can be bonded smoothly onthe display panel 100.

Please refer to FIG. 5, which is a schematic structural diagram of adisplay panel according to a third embodiment of the present disclosure.The display panel 100 shown in FIG. 5 is basically similar to thedisplay panel 100 shown in FIG. 2, and their difference is that theoutput leads 113, the group of first input leads 111, and the group ofsecond input leads 112 are disposed side by side at a side of thedriving chip 11, near the display area 100 a, the output leads 113 arelocated between the group of first input leads 111 and the group ofsecond input leads 112, and the virtual leads 114 are located at a sideof the driving chip 11, away from the display area 100 a.

The first bonding pads 141 (such as the first child bonding pad 1411),near the first input leads 1111, are electrically connected to the firstinput leads 1111, near the first bonding pads 141, through the firstconducting wires 161. One end of the first conducting wire 161 isconnected to one end of the first input lead 1111 near the first bondingpads 141, away from the display area 100 a. The first bonding pads141(such as the sixth child bonding pad 1416), away from the first inputleads 1111, are electrically connected to the first input leads 1111,away from the first bonding pads 141, through the second conductingwires 162. One end of the second conducting wires 162 is connected toone end of the first input lead 1111 away from the first bonding pads141, near the display area 100 a. The lengths of the first conductingwires 161 are less than those of the second conducting wires 162.

As shown in FIG. 6, which is a schematic structural diagram of a displaypanel according to a fourth embodiment of the present disclosure. Thedisplay panel shown in FIG. 6 is basically similar to the display panelshown in FIG. 5, and their difference is that, the first bonding pads141 (such as the first child bonding pad 1411), near the first inputleads 1111, are electrically connected to the first input leads 1111,away from the first bonding pads 141, through the first conducting wires161, and the first bonding pads 141(such as the sixth child bonding pad1416), away from the first input leads 1111, are electrically connectedto the first input leads 1111, near the first bonding pads 141, throughthe second conducting wires 162. Therefore, the lengths of the firstconducting wires 161 and the second conducting wires 162 tend to beidentical, thereby causing impedance of the first conducting wires 161and the second conducting wires 162 to be more synchronized.

It needs to be stated that in the display panel shown in FIG. 5 and FIG.6, a part of conducting wires (such as the first conducting wires 161)connecting the first input leads 1111 and the first bonding pads 141 areconnected to ends of the first input leads 1111, away from the displayarea 100 a, and a part of conducting wires (such as the secondconducting wires 162) connecting the first input leads 1111 and thefirst bonding pads 141 are connected to ends of the first input leads1111, near the display area 100 a. A sufficient layout space at the sideof the driving chip 11, away from the display area 100 a (i.e., a sideof the driving chip 11 where the virtual leads 114 are disposed)coordinates that the heights of a part of the first bonding pads 141gradually increase from the side near the driving chip 11 to the sideaway from the driving chip 11, causing short circuits not to occur dueto a more sufficient layout space at the side of the driving chip 11,away from the display area 100 a (i.e., the side of the driving chip 11where the virtual leads 114 are disposed), for the conducting wires(such as the first conducting wires 161) connecting the first inputleads 1111 and the first bonding pads 141 near the driving chip 11.Moreover, the part of conducting wires (such as the second conductingwires 162) connecting the first input leads 1111 and the first bondingpads 141 are connected to the ends of the first input leads 1111, nearthe display area 100 a, causing the conducting wires not to gather in anarea so that short circuits are prevented from occurring between theconducting wires further. For the same reason, short circuits are alsoprevented from occurring between the conducting wires connecting thesecond input leads 1121 and the second bonding pads 142. In addition,space occupied by a part of the conducting wires connecting the secondinput leads 1121 and the second bonding pads 142, space occupied by apart of the conducting wires connecting the first input leads 1111 andthe first bonding pads 141, and space for bonding the driving chip 11overlap, thereby reducing the whole space occupied by the conductingwires besides the space occupied by the driving chip 11.

Please refer to FIG. 7, which is a schematic structural diagram of adisplay panel according to a fifth embodiment of the present disclosure.The display panel 100 shown in FIG. 7 is basically similar to thedisplay panel 100 shown in FIG. 2, and their difference is that, theoutput leads 113 are located in the middle of the driving chip 11, nearthe display area 100 a, and disposed at sides of the group of firstinput leads 111 and the group of second input leads 112, opposite toeach other. Furthermore, the virtual leads 114, the group of first inputleads 111, and the group of second input leads 112 are disposed side byside at the side of the driving chip 11, away from the display area 100a, and the virtual leads 114 are located between the group of firstinput leads 111 and the group of second input leads 112.

Please refer to FIG. 8, which is a schematic structural diagram of adisplay panel according to a sixth embodiment of the present disclosure.The display panel 100 shown in FIG. 8 is basically similar to thedisplay panel 100 shown in FIG. 7, and their difference is that, a partof the virtual leads 114, the group of first input leads 111, and thegroup of second input leads 112 are disposed side by side at the side ofthe driving chip 11, away from the display area 100 a, and the part ofthe virtual leads 114 are located between the group of first input leads111 and the group of second input leads 112; and a part of the virtualleads 114 and the output leads 113 are disposed side by side at the sideof the driving chip 11, near the display area 100 a, and the part of thevirtual leads 114 are located at two sides of the output leads 113.Relative to the driving chip shown in FIG. 7, the driving chip shown inFIG. 8 can be bonded more smoothly on the display panel.

The present disclosure further provides a driving chip. The driving chipincludes a plurality of input leads including a group of first inputleads and a group of second input leads. The group of first input leadsand the group of second input leads are disposed at an interval. Whenthe driving chip is bonded on the display panel, the group of firstinput leads and the group of second input leads are disposed near theircorresponding bonding pads respectively, causing the distances betweenthe first input leads and corresponding bonding pads and between thesecond input leads and corresponding bonding pads to become short, andthus shortening conducting wires, connecting the first input leads andthe corresponding bonding pads, and conducting wires, connecting thesecond input leads and the corresponding bonding pads, so that impedanceof conducting wires becomes small, electrical signals inputted to thedriving chip through the conducting wires are normal, and thus thedisplay panel displays normally.

Please refer to FIGS. 2, 4, 5, and 6, the group of first input leads 111and the group of second input leads 112 are disposed side by side at thesame side of the driving chip 11. The driving chip 11 further includes aplurality of output leads 113. The output leads 113, the group of firstinput leads 111, and the group of second input leads 112 are disposedside by side. The output leads 113 are located between the group offirst input leads 111 and the group of second input leads 112.

Please refer to FIG. 7 and FIG. 8, the driving chip 11 further includesa plurality of output leads 113. The output leads 113 are disposed atsides of the first input leads 1111 and the second input leads 1121,opposite to each other. The output leads 113 are located at the middleof a side of the driving chip 11.

Please refer to FIG. 7, the driving chip 11 further includes a pluralityof virtual leads 114. The virtual leads 114, the group of first inputleads 111, and the group of second input leads 112 are disposed side byside. The virtual leads 114 are located between the group of first inputleads 111 and the group of second input leads 112.

Please refer to FIGS. 2, 4, 5, and 6, the driving chip 11 furtherincludes a plurality of virtual leads 114. The virtual leads 114 aredisposed at sides of the first input leads 1111 and the second inputleads 1121, opposite to each other.

The descriptions of the above embodiments are merely used to understandthe technical solutions and the core ideas of the present disclosure. Itshould be understood that a person of ordinary skill in the art canstill make modifications corresponding to the technical solutionsdescribed in the above embodiments, or replace a part of technicalfeatures thereof equivalently. These modifications and replacementcannot cause the essence of corresponding technical solutions to escapefrom the scope of the technical solutions described in the embodimentsof the present disclosure.

What is claimed is:
 1. A display panel, comprising: a display area and anon-display area located at the outside of the display area; wherein adriving chip, and a plurality of first bonding pads and a plurality ofsecond bonding pads disposed at two opposite sides of the driving chipare disposed in the non-display area; and wherein the driving chipcomprises a plurality of input leads comprising a group of first inputleads and a group of second input leads, wherein the group of firstinput leads is disposed near the plurality of first bonding pads,wherein the group of second input leads is disposed near the pluralityof second bonding pads, and wherein there is an interval between thegroup of first input leads and the group of second input leads.
 2. Thedisplay panel of claim 1, wherein each of the first input leads iselectrically connected to each of the plurality of first bonding padsthrough conducting wires, and wherein each of the second input leads iselectrically connected to each of the plurality of second bonding padsthrough the conducting wires.
 3. The display panel of claim 1, whereinthe group of first input leads and the group of second input leads aredisposed side by side at the same side of the driving chip.
 4. Thedisplay panel of claim 3, wherein the driving chip further comprises aplurality of output leads.
 5. The display panel of claim 4, wherein theplurality of output leads, the group of first input leads, and the groupof second input leads are disposed side by side, and wherein theplurality of output leads are located between the group of first inputleads and the group of second input leads.
 6. The display panel of claim4, wherein the plurality of output leads are disposed at sides of thegroup of first input leads and the group of second input leads, oppositeto each other.
 7. The display panel of claim 4, wherein the driving chipfurther comprises a plurality of virtual leads.
 8. The display panel ofclaim 7, wherein the plurality of output leads, the group of first inputleads, and the group of second input leads are disposed side by side ata side of the driving chip, away from the display area, wherein theplurality of output leads are located between the group of first inputleads and the group of second input leads, and wherein the plurality ofvirtual leads are located at a side of the driving chip, near thedisplay area.
 9. The display panel of claim 8, wherein the plurality offirst bonding pads, near the first input leads, are electricallyconnected to the first input leads, near the plurality of first bondingpads, through first conducting wires, and wherein the plurality of firstbonding pads, away from the first input leads, are electricallyconnected to the first input leads, away from the plurality of firstbonding pads, through second conducting wires.
 10. The display panel ofclaim 7, wherein the plurality of output leads, the group of first inputleads, and the group of second input leads are disposed side by side ata side of the driving chip, near the display area, wherein the pluralityof output leads are located between the group of first input leads andthe group of second input leads, and wherein the plurality of virtualleads are located at a side of the driving chip, away from the displayarea.
 11. The display panel of claim 10, wherein the plurality of firstbonding pads, near the first input leads, are electrically connected tothe first input leads, away from the plurality of first bonding pads,through first conducting wires, and wherein the plurality of firstbonding pads, away from the first input leads, are electricallyconnected to the first input leads, near the plurality of first bondingpads, through second conducting wires.
 12. The display panel of claim 7,wherein the plurality of output leads are located at a side of thedriving chip, near the display area, wherein the plurality of virtualleads, the group of first input leads, and the group of second inputleads are disposed side by side at a side of the driving chip, away fromthe display area, and wherein the plurality of virtual leads are locatedbetween the group of first input leads and the group of second inputleads.
 13. The display panel of claim 2, wherein heights of a part ofthe plurality of first bonding pads and heights of a part of theplurality of second bonding pads increase gradually from a side near thedriving chip to a side away from the driving chip.
 14. The display panelof claim 13, wherein a first bonding pad group is composed of the partof the plurality of first bonding pads, wherein a third bonding padgroup is composed of the part of the plurality of second bonding pads,wherein the plurality of first bonding pads of the first bonding padgroup are arranged continuously or discontinuously, and wherein theplurality of second bonding pads of the third bonding pad group arearranged continuously or discontinuously.
 15. A driving chip, comprisinga plurality of input leads comprising a group of first input leads and agroup of second input leads, wherein the group of first input leads andthe group of second input leads are disposed at an interval.
 16. Thedriving chip of claim 15, wherein the group of first input leads and thegroup of second input leads are disposed side by side at the same sideof the driving chip.
 17. The driving chip of claim 16, furthercomprising a plurality of output leads, wherein the plurality of outputleads, the group of first input leads, and the group of second inputleads are disposed side by side, and wherein the plurality of outputleads are located between the group of first input leads and the groupof second input leads.
 18. The driving chip of claim 16, furthercomprising a plurality of output leads, wherein the plurality of outputleads are disposed at sides of the first input leads and the secondinput leads, opposite to each other.
 19. The driving chip of claim 16,further comprising a plurality of virtual leads, wherein the pluralityof virtual leads, the group of first input leads, and the group ofsecond input leads are disposed side by side, and wherein the pluralityof virtual leads are located between the group of first input leads andthe group of second input leads.
 20. The driving chip of claim 16,further comprising a plurality of virtual leads, wherein the pluralityof virtual leads are disposed at sides of the first input leads and thesecond input leads, opposite to each other.